Modeling and experimental investigation of damage initiation and propagation of LQFP package under thermal cycle
Thermo mechanical fatigue and damage have been always an issue for solder joint
materials used in microelectronics. Accurate damage and crack prediction is important to …
materials used in microelectronics. Accurate damage and crack prediction is important to …
Modeling and experimentation of creep-fatigue and failure of low-profile quad flat package under thermal cycle
A Halouani, A Cherouat… - Proceedings of the …, 2020 - journals.sagepub.com
An experimental investigation and numerical modeling using multiphysics finite element
method were performed to study the thermal failure mechanism of low-profile quad flat …
method were performed to study the thermal failure mechanism of low-profile quad flat …
Fatigue prediction for molded wafer-level package during temperature cycling
WC Chuang, WL Chen - Journal of …, 2020 - asmedigitalcollection.asme.org
A molded wafer-level package simulation model was successfully developed for calculating
solder ball fatigue life during a temperature cycle test (TCT), revealing that the most crucial …
solder ball fatigue life during a temperature cycle test (TCT), revealing that the most crucial …
Modules intégrés en technologie LTCC pour des applications en bande D (110-170 GHz)
M Tlili - 2020 - theses.hal.science
Cette thèse a pour objectif de réaliser des modules d''émission-réception (front-end TRX)
faible coût, en band D (110-170 GHz), utilisant des puces intégrées MMIC reportées sur un …
faible coût, en band D (110-170 GHz), utilisant des puces intégrées MMIC reportées sur un …