Ball grid array (BGA) test vehicles, assembled in a standard surface mount technology
(SMT) line, were used to prepare fracture specimens in seven configurations in order to …

The mixed-mode fracture energies of copper–SAC305–copper solder joints were measured
using both an Arcan-type specimen and a double-cantilever beam (DCB) specimen. The …

Fracture tests were conducted on copper–solder–copper joints of various lengths using
double-cantilever-beam (DCB) specimens under mode I loading conditions. The thickness …

Double cantilever beam (DCB) and Arcan-type specimens have been used extensively in
the literature to measure fracture properties of solder joints. However, the results obtained …

The critical strain energy release rate at crack initiation, J ci, has been shown to govern the
fracture of short solder joints. The present work measured J ci for 2 mm long SAC305 solder …

The effect of the joint length on the fracture of coppersolder-copper joints were investigated
using doublecantilever-beam (DCB) specimens of various joint lengths. It was found that for …