Contact resistance in organic field‐effect transistors: conquering the barrier
M Waldrip, OD Jurchescu… - Advanced functional …, 2020 - Wiley Online Library
Organic semiconductors have sparked interest as flexible, solution processable, and
chemically tunable electronic materials. Improvements in charge carrier mobility put organic …
chemically tunable electronic materials. Improvements in charge carrier mobility put organic …
Carbon nanotube transistor technology for More-Moore scaling
Q Cao - Nano Research, 2021 - Springer
Scaling of silicon field-effect transistors has fueled the exponential development of
microelectronics in the past 60 years, but is now close to its physical limits with the critical …
microelectronics in the past 60 years, but is now close to its physical limits with the critical …
Flexible low-voltage high-frequency organic thin-film transistors
JW Borchert, U Zschieschang, F Letzkus, M Giorgio… - Science …, 2020 - science.org
The primary driver for the development of organic thin-film transistors (TFTs) over the past
few decades has been the prospect of electronics applications on unconventional substrates …
few decades has been the prospect of electronics applications on unconventional substrates …
End-bonded contacts for carbon nanotube transistors with low, size-independent resistance
Moving beyond the limits of silicon transistors requires both a high-performance channel
and high-quality electrical contacts. Carbon nanotubes provide high-performance channels …
and high-quality electrical contacts. Carbon nanotubes provide high-performance channels …
Defining and overcoming the contact resistance challenge in scaled carbon nanotube transistors
AD Franklin, DB Farmer, W Haensch - ACS nano, 2014 - ACS Publications
Carbon nanotubes (CNTs) continue to show strong promise as the channel material for an
aggressively scaled, high-performance transistor technology. However, there has been …
aggressively scaled, high-performance transistor technology. However, there has been …
Challenges of nickel silicidation in CMOS technologies
In this paper, we review some of the key challenges associated with the Ni silicidation
process in the most recent CMOS technologies. The introduction of new materials (eg SiGe) …
process in the most recent CMOS technologies. The introduction of new materials (eg SiGe) …
TiSi(Ge) Contacts Formed at Low Temperature Achieving Around cm2 Contact Resistivities to p-SiGe
H Yu, M Schaekers, J Zhang, LL Wang… - … on Electron Devices, 2017 - ieeexplore.ieee.org
This paper reports ultralow contact resistivities (ρ c) achieved on highly doped p-SiGe with
two low-temperature contact formation methods. One method combines precontact …
two low-temperature contact formation methods. One method combines precontact …
Titanium-based ohmic contacts in advanced CMOS technology
S Mao, J Luo - Journal of Physics D: Applied Physics, 2019 - iopscience.iop.org
Since the contact resistance characterized by a specific contact resistivity (ρ c) in the
source/drain (S/D) regions is becoming a bottleneck for further improving device …
source/drain (S/D) regions is becoming a bottleneck for further improving device …
Low-resistance titanium contacts and thermally unstable nickel germanide contacts on p-type germanium
H Yu, M Schaekers, T Schram… - IEEE Electron …, 2016 - ieeexplore.ieee.org
Ti/p-Ge and NiGe/p-Ge contacts are compared on both planar-and fin-based devices. Ti/p-
Ge contacts show low contact resistance, while NiGe/p-Ge devices show short circuit …
Ge contacts show low contact resistance, while NiGe/p-Ge devices show short circuit …
Segregation and activation of Ga in high Ge content SiGe by UV melt laser anneal
The feasibility of dopant activation surpassing the equilibrium solid solubility limit by using
an out of equilibrium melt laser annealing (MLA) process was investigated. To that end, we …
an out of equilibrium melt laser annealing (MLA) process was investigated. To that end, we …