The growth in 5G, AI, HPC and IoT have been in the rise in the past few years. This
exponential growth has led to research and development of co-packaged optics (CPO) …

As electronic packages continue to get smaller, designing reliable solder joints is becoming
an increasingly important part of the design process. The shape and height of the solder …

Residual stress has been a big concern during the fabrication and assembly which may
damage the electronic device or shorten the device's lifetime. Several methods have been …

As the industry moves towards miniaturization of electronics, the need for higher accuracy in
in-plane and out-of-plane deformation measurement techniques keeps increasing. Due to a …

Lead-free SAC solder pastes have been widely used in electronic packages. To reduce the
reflow energy cost, low melting temperature solder alloys are now receiving more attention …