The heat generation of electronic devices is increasing dramatically, which causes a serious
bottleneck in the thermal management of electronics, and overheating will result in …

The multi-functionalization of polymer composites refers to the ability to connect multiple
properties through simple structural design and simultaneously achieve multi-performance …

Based on the broad scope of applications in electronics, the development requirements of
excellent electronic packaging materials with efficient thermal management performance …

Heat dissipation efficiency and electromagnetic interference (EMI) shielding performance
are vital to integration, miniaturization, and application of electronic devices. Flexible and …

The photothermal agents were frequently introduced into phase change materials (PCMs) to
attain light harvesting ability, which have imparted PCMs with actively thermal management …

Thermal energy harvesting, management and utilization with phase change materials have
garnered increasing attention in integrated electronic cooling and high-power-density …

Phase change materials (PCMs) have attracted considerable attention for their energy
storage and thermoregulatory properties. However, the solid–liquid leakage, low thermal …

In the face of increased heat dissipation requirements of high-power electronic devices, the
fabrication of graphitic foil with high thermal conductivity is urgently needed. In this work …

Phase change materials (PCMs) as one of the most potential latent heat storage techniques
have been widely used for thermal management and energy storage. However …

In the rapidly advancing information age, the demand for highly thermally conductive and
insulating materials is increasing due to the miniaturization and high-power density of …