It is widely recognized that nanoscience and nanotechnology and their subfields, such as
nanophotonics, nanoelectronics, and nanomechanics, have had a tremendous impact on …

The performance of modern chips is strongly related to the multi-layer interconnect structure
that interfaces the semiconductor layer with the outside world. The resulting demand to …

Ruthenium and molybdenum are of great potential to replace copper for use as the next-
generation interconnect metallization. Important parameters including their intrinsic …

Thermal atomic layer etching (ALE) of CoO was demonstrated using sequential exposures
of acetylacetone (Hacac) and ozone (O 3). During the surface reactions, Hacac can remove …

Analog matrix computing (AMC) with resistive memory implies naturally massive parallelism
and in-memory processing, thus representing a promising solution for accelerating data …

The miniaturization of electronic devices highlights the need for robust low‐κ materials as an
alternative to prevent losses in the performance of integrated circuits. For it, surface …

New interconnect materials that have a low line resistivity are required to address issues
associated with the increased resistivity due to the aggressive downscaling of future …

Untethered computing using deep convolutional neural networks (DCNNs) at the edge of
IoT with limited resources requires systems that are exceedingly power and area-efficient …

Analog resistive random access memory (RRAM) devices enable parallelized nonvolatile in-
memory vector-matrix multiplications for neural networks eliminating the bottlenecks posed …

Nanotechnology is the branch of science that deals in technology at the scale of
nanometers. To put it in perspective, a human hair can be around 1, 00,000 nanometers …