Fast thermal analysis for chiplet design based on graph convolution networks
2.5 D chiplet-based technology promises an efficient integration technique for advanced
designs with more functionality and higher performance. Temperature and related thermal …
designs with more functionality and higher performance. Temperature and related thermal …
Making sense of thermoelectrics for processor thermal management and energy harvesting
S Jayakumar, S Reda - … on Low Power Electronics and Design …, 2015 - ieeexplore.ieee.org
A thermoelectric (TE) device can be used as a heat pump that consumes electric power to
cool a processor chip, or it can be used as a heat engine that generates electricity from the …
cool a processor chip, or it can be used as a heat engine that generates electricity from the …
Electrothermal simulation and optimal design of thermoelectric cooler using analytical approach
In this article, electrothermal modeling and simulation of thermoelectric cooling (TEC) in the
package design of VLSI systems are performed by solving coupled heat conduction and …
package design of VLSI systems are performed by solving coupled heat conduction and …
Systemic optimization of on-chip thermoelectric cooling
T Rangarajan, T Karnik, R Khanna… - 2015 IEEE CPMT …, 2015 - ieeexplore.ieee.org
Economic viability of on-package, in-situ cooling based on Thin-film Thermoelectric
Coolants (TF-TEC) for hot-spot cooling involves myriad challenges necessitating …
Coolants (TF-TEC) for hot-spot cooling involves myriad challenges necessitating …