As a powerful enabling technology, three-dimensional (3D) integration, which uses wafer
bonding to integrate multiple wafers in the vertical direction and uses through‑silicon-vias …

This letter presents a piezoelectric tuning fork resonator vibrating in in-plane flexural mode
with a high quality factor (Q) and low motional impedance. A novel double-sided actuating …

A novel three-dimensional (3D) hermetic packaging technique suitable for capacitive
microelectromechanical systems (MEMS) sensors is studied. The composite substrate with …

This paper investigates the impact of base and anchor on the quality factor (Q) of
piezoelectric microelectromechanical system (MEMS) tuning fork resonators vibrating in in …

Tuning fork gyroscopes (TFGs) are promising for potential high-precision applications. This
work proposes and experimentally demonstrates a novel high-Q dual-mass tuning fork …

In this work we present aspects of our versatile hermetically sealed sensor platform. The
sealed glass package can include passive and active devices (radar, pressure, infrared …

This paper presents a wafer-level three-dimensional (3D) vacuum packaging technique for
radio frequency microelectromechanical systems (RF MEMS) resonators. A Sn-rich Au–Sn …

This paper is focused on electrode design for piezoelectric tuning fork resonators. The
relationship between the performance and electrode pattern of aluminum nitride …

In this work, we present the realized versatile hermetically sealed sensor packaging platform
based on glass interposers which is applicable in industrial metrology, MEMS, photonics, life …

The 3-D heterogeneous integration technology of microsystem is the best technical means
to achieve higher integration, higher performance and higher working frequency of radio …