Interconnects plays an important role in integrated circuits. Copper is used as an
interconnect material, but beyond 22 nm technology node it faces many problems due to …

Having a 1D material like Multiwall Carbon Nanotube (MWCNT) as a potential candidate for
high speed Very Large Scale Integration (VLSI) interconnect creates a good scope to reduce …

A temperature dependent performance in terms of power delay product (PDP) of multi-
walled carbon nanotube (MWCNT) bundle interconnect has been analyzed for temperature …

In recent past, the cross‐coupling crosstalk becomes a dominating factor due to the closer
proximity of wire that reduces the performance of coupled interconnects at lower technology …

The sub-threshold regime is suited for applications requiring ultra-low power consumption
with low to medium frequency (tens to hundreds of MHz) of operation. Therefore, this paper …

The performance of Mixed-Multi-Walled Carbon Nanotube nanostructure (MMT) used as
interconnect at Nanotechnology nodes for global length are calculated and compared the …

The performance of mixed multi-walled carbon nanotube nanostructures, consisting of
differently sized multi-walled carbon nanotube bundles, was evaluated as very large scale …

On-chip global interconnects are becoming speed and power bottlenecks in state-of-the-art
chips. Low-swing signaling is used to improve delay performance and reduce power …

An uncommon circuit modelling of microelectrode for ultra-short signal propagation is
developed. The proposed model is based on the Tensorial Analysis of Network (TAN) using …

This paper presents the performance of thermally-aware Mixed-MWCNTB (MMB) as VLSI
interconnects material for nano-scaled technology nodes. A thermally aware multiple …