Three-dimensional interconnected networks for thermally conductive polymer composites: Design, preparation, properties, and mechanisms

F Zhang, Y Feng, W Feng - Materials Science and Engineering: R: Reports, 2020 - Elsevier
With the development of science and technology, microelectronic components have evolved
to become increasingly integrated and miniaturized. As a result, thermal management …

Thermal conductivity of carbon nanotube networks: A review

B Kumanek, D Janas - Journal of materials science, 2019 - Springer
Depending on their structure and order (individual, films, bundled, buckypapers, etc.),
carbon nanotubes (CNTs) demonstrate different values of thermal conductivity, from the …

Highly thermally conductive 3D printed graphene filled polymer composites for scalable thermal management applications

H Guo, H Zhao, H Niu, Y Ren, H Fang, X Fang, R Lv… - ACS …, 2021 - ACS Publications
Efficient thermal transportation in a preferred direction is highly favorable for thermal
management issues. The combination of 3D printing and two-dimensional (2D) materials …

Thermal conductivity of polymer-based composites: Fundamentals and applications

H Chen, VV Ginzburg, J Yang, Y Yang, W Liu… - Progress in Polymer …, 2016 - Elsevier
Thermal management is critical to the performance, lifetime, and reliability of electronic
devices. With the miniaturization, integration and functionalization of electronics and the …

Metal-level thermally conductive yet soft graphene thermal interface materials

W Dai, T Ma, Q Yan, J Gao, X Tan, L Lv, H Hou, Q Wei… - ACS …, 2019 - ACS Publications
Along with the technology evolution for dense integration of high-power, high-frequency
devices in electronics, the accompanying interfacial heat transfer problem leads to urgent …

[HTML][HTML] A review of carbon-based thermal interface materials: Mechanism, thermal measurements and thermal properties

X Guo, S Cheng, W Cai, Y Zhang, X Zhang - Materials & Design, 2021 - Elsevier
With the development of electronic technologies, electronic devices become smaller, while
their power density increases dramatically. The resulting excessive heat requires excellent …

[HTML][HTML] Thermal diodes, regulators, and switches: Physical mechanisms and potential applications

G Wehmeyer, T Yabuki, C Monachon, J Wu… - Applied Physics …, 2017 - pubs.aip.org
Interest in new thermal diodes, regulators, and switches has been rapidly growing because
these components have the potential for rich transport phenomena that cannot be achieved …

Thermal transport in polymeric materials and across composite interfaces

N Mehra, L Mu, T Ji, X Yang, J Kong, J Gu, J Zhu - Applied Materials Today, 2018 - Elsevier
Thermal conduction in polymeric materials and across interfaces is of considerable scientific
and technological importance nevertheless only very few studies are available without …

One-dimensional metal nanostructures: from colloidal syntheses to applications

D Huo, MJ Kim, Z Lyu, Y Shi, BJ Wiley, Y Xia - Chemical reviews, 2019 - ACS Publications
This Review offers a comprehensive review of the colloidal synthesis, mechanistic
understanding, physicochemical properties, and applications of one-dimensional (1D) metal …

Thermal percolation threshold and thermal properties of composites with high loading of graphene and boron nitride fillers

F Kargar, Z Barani, R Salgado, B Debnath… - … applied materials & …, 2018 - ACS Publications
We investigated thermal properties of the epoxy-based composites with the high loading
fraction—up to f≈ 45 vol%—of the randomly oriented electrically conductive graphene fillers …