A survey on industrial information integration 2016–2019

Y Chen - Journal of Industrial Integration and Management, 2020 - World Scientific
Industrial information integration engineering (IIIE) is a set of foundational concepts and
techniques that facilitate the industrial information integration process. In recent years, many …

Compact thermal model of the pulse transformer taking into account nonlinearity of heat transfer

K Górecki, K Detka, K Górski - Energies, 2020 - mdpi.com
This paper presents a compact nonlinear thermal model of pulse transformers. The
proposed model takes into account differentiation in values of the temperatures of a …

Novel approach to the extraction of Delphi-like boundary-condition-independent compact thermal models of planar transformer devices

V Bissuel, L Codecasa, E Monier-Vinard… - … Investigations of ICs …, 2018 - ieeexplore.ieee.org
Planar Magnetic Components are new alternatives to classic transformers. Based on the
combination of a low profile high frequency magnetic core and a Printed Circuit Board, these …

Multi-port dynamic compact thermal models of dual-chip package using model order reduction and metaheuristic optimization

B Rogié, L Codecasa, E Monier-Vinard… - Microelectronics …, 2018 - Elsevier
Delphi-like boundary condition independent (BCI) compact thermal models (CTMs) are the
standard for modelling single die packages. However their extraction, particularly in the …

Thermal resistance advanced calculator (TRAC)

L Codecasa, S Race, V d'Alessandro… - … Investigations of ICs …, 2018 - ieeexplore.ieee.org
A novel simulation tool, named Thermal Resistance Advanced Calculator, is presented Such
a tool allows the straightforward definition of a parametric detailed thermal model of family of …

Galerkin's Projection Framework for BCI CTMs—Part I: Extended FANTASTIC Approach

L Codecasa, V d'Alessandro… - IEEE Transactions on …, 2021 - ieeexplore.ieee.org
A general Galerkin's projection framework is proposed for the definition of boundary
condition independent (BCI) compact thermal models (CTMs). First, it is shown how the …

Versatile MOR-based boundary condition independent compact thermal models with multiple heat sources

L Codecasa, R Bornoff, J Dyson, V d'Alessandro… - Microelectronics …, 2018 - Elsevier
This paper shows that the connection of MOR-based boundary condition independent (BCI)
dynamic compact thermal models (DCTMs) and detailed models of heat transfer problems is …

Multi-port Dynamic Compact Thermal Models of BGA package using Model Order Reduction and Metaheuristic Optimization

V Bissuel, V Fox, E Monier-Vinard… - 2019 18th IEEE …, 2019 - ieeexplore.ieee.org
Thermal behavior of electronic devices can be more and more finely predicted using the
latest thermo-fluidic simulation tools. But when realistic three-dimensional geometric …

TRAC: A thermal resistance advanced calculator for electronic packages

L Codecasa, S Race, V d'Alessandro, D Gualandris… - Energies, 2019 - mdpi.com
This paper presents a novel simulation tool named thermal resistance advanced calculator
(TRAC). Such a tool allows the straightforward definition of a parametric detailed thermal …

Thermal resistance and impedance calculator (TRIC)

L Codecasa, F De Viti, S Race… - … Investigations of ICs …, 2019 - ieeexplore.ieee.org
This paper presents the Thermal Resistance and Impedance Calculator (TRIC) simulation
tool, extending the TRAC tool, for the automatic extraction of thermal metrics of package …