The advent of foldable and wearable devices, such as the Samsung Galaxy Fold (2019) and
Huawei Mate X (2019), require increased battery size and processor performance to drive …

Thermal ground planes (TGPs) are considered to be one the most promising thermal
management devices for cooling the high heat flux miniaturized power electronic devices …

The increasing heat flux of electronic systems, caused by the miniaturization and high
integration, has posed a huge challenge to efficient and effective thermal management …

Data centers have tended to develop towards large scale and high density, with overall
power consumption reaching up to 3% of the total national electricity consumption. It is vital …

Vapor-chamber heat spreaders are hermetically-sealed systems that rely on metal wicks to
circulate a phase-changing liquid and spread heat more efficiently than solid-metal heat …

We investigated the thermal performance of a novel wettability patterned evaporator for an
ultrathin vapor chamber. Because the evaporator integrates a wettability patterned substrate …

For the challenge of cooling hotspots in the burgeoning electronics/optoelectronics
equipment, vapor chambers provide a promising solution based on a distinctive passive two …

Modern electronic devices with high heat flux increasingly exceed the capability of thermal
management method. Two-phase thermal dissipation devices such as vapor chambers offer …

The objective of this research is to present an investigation the thermal resistance of ten
vapor chambers with different configuration structures with different working fluid fill ratios …

With the rapid development of photoelectric products, their miniaturization and high
integration have intensified the problem of heat dissipation. In this paper, a new type of …