Automatic wire bonding is a highly mature, cost-efficient and broadly available back-end
process, intended to create electrical interconnections in semiconductor chip packaging …

Abstract “Heterogeneous Integration” is a promising approach for high‐performance hybrid
flexible electronics that combine printed electronics and silicon technology. Despite …

Heterogeneous integration on flexible substrates has been explored in recent years to meet
the high‐performance and flexible form factors requirements of several emerging …

The nanoscale interfacial characteristics of thermosonic copper ball bonding on aluminium
metallization were investigated. It was found that ultrasonic vibration swept oxides of …

In this work, we investigate the intermetallic compound formation in Cu wire bonded device.
Voids near the Cu side at the bond interface are clearly seen. Nevertheless, these voids do …

Wire bonding is the predominant mode of interconnection in electronic packaging. Gold wire
bonding has been refined again and again to retain control of interconnect technology due …

In this study, Cu wire bonds are aged at 150, 175, 250, and 350° C for time ranging from 5
min to 2000 h. The top temperature of 350° C is chosen to have the fastest kinetics, while …

In semiconductor manufacturing, understanding how various materials behave and interact
is critical to making a reliable and robust semiconductor package. Semiconductor …

Thermosonic ball bonding processes on test chips with Al metallized bonding pads are
optimized with one Au and two Cu wire types, all 25 mum diameter, obtaining average shear …

Cu bonding wire is more and more used for interconnections to integrated circuits (ICs) to
reduce cost and increase performance compared to Au wire. To eliminate underpad …