This article proposes a computational fluid dynamics (CFD)-based machine learning (ML)
model to set the temperature of a convection reflow oven and control conveyor speed. Due …

As surface mount components shrink in size, smaller apertures on stencils during solder
paste printing can lead to uneven solder volume on a single resistor. This can result in the …

Purpose This paper aims to propose a method to quickly set the heating zone temperatures
and conveyor speed of the reflow oven. This novel approach intensely eases the trial and …

This paper presents a comparative study that demonstrates the influence of solder joint
shapes on the drop test performance of chip resistors. A 77 by 77 mm 2 test board that …

As electronic packages continue to get smaller, designing reliable solder joints is becoming
an increasingly important part of the design process. The shape and height of the solder …

With smaller and denser transistors, the physical flow of electrons may inhibit the
performance of the device over time by forming voids and cracks at interconnects due to …

Reflow soldering is a technique that temporarily applies solder paste to contact pads of
numerous surface mount components Reflow profiling is an optimization process to …

This study introduces a novel method for expeditiously configuring the heating zone
temperatures and conveyor speed of a reflow oven, particularly for thick PCBs with bulky …

The interconnections and chips of the internal components of electronic devices need to be
protected to prevent damage during shipping, handling, and daily use. This article studied …

Abstract The Integrated Circuit (IC) packaging sector is experiencing heightened demand for
compact, and efficient packages, driven by advancements in AI and 5G technologies. This …