Embodiments include a microelectronic device package structure having an inductor at least
partially embedded within a substrate. At least one thermal solution structure may be on a …

Embodiments include a microelectronic device package structure having an inductor within
a portion of a substrate, wherein the inductor is at least partially embedded within the …

An apparatus is provided which comprises: one or more pads comprising metal on a first
substrate surface, the one or more pads to couple with contacts of an integrated circuit die …

Embodiments include a microelectronic device package structure having an inductor within
a portion of a substrate, wherein a surface of the inductor is substantially coplanar with a …

An electronic package comprises an integrated circuit (IC) configured to receive a power
input signal and to deliver a regulated power output signal. A multilayer electrical routing …

Distributions of on-chip inductors for monolithic voltage regulation are described. On-chip
voltage regulation may be provided by integrated voltage regulators (IVRs), such as a buck …

Embodiments include a reflowable grid array (RGA) inter poser, a semiconductor packaged
system, and a method of forming the semiconductor packaged system. The RGA interposer …

(IC) package supports, and related devices and methods. For example, in some
embodiments, an IC package support may include a core region having a first face and an …

Embodiments include a microelectronic device package structure having an inductor within
a portion of a substrate, wherein a surface of the inductor is substantially coplanar with a …

An apparatus is provided which comprises: one or more pads comprising metal on a first
substrate surface, the one or more pads to couple with contacts of an integrated circuit die …