Metallic phase change materials offer an approach to rapidly transport heat away from a
critical device, and to store that heat using the latent heat of fusion, buffering the temperature …

The variations of thermal conductivity with temperature for Al–[x] wt.% Cu, x= 3, 6, 15 and 24
alloys were measured by using a radial heat flow apparatus. The variations of electrical …

Interfacial adhesive energy was evaluated quantitatively in relation to the bonding
temperature and subsequent thermal treatment to develop a Cu-Cu thermal compressed …

The electromigration (EM) lifetime of copper pillars were investigated by orthogonal tests.
According to the Black's mean-time-to-failure equation, the activation energy and exponent …

In this study, eutectic-Bi–Sn-coated basalt fiber (BF)-reinforced carbon nanotube
(CNT)/epoxy hybrid composites were fabricated for dual functionality, ie, in managing and …

The effect of electroless nickel immersion gold (ENIG) and organic solderability preservative
(OSP) surface finishes on the shear strength of Sn–3.0 Ag–0.5 Cu solder joints were …

Thermal annealing and electromigration (EM) tests were performed at 125–175° C with 2.2×
104A/cm2 conditions in order to investigate the growth kinetics of intermetallic compound …

Electrical pulse-assisted creep ageing forming can effectively improve the mechanical
properties and forming efficiency of large aluminum components. However, it is difficult to …

The electrical conductivity is the fundamental physical property of Mg alloys and the basic
information for the design of comprehensive high-performance Mg alloys. In this work, the …

An investigation of the effects of thermal annealing on the growth of intermetallic compounds
(IMCs) and the shear strength of Cu/Sn/Cu pillar bump structures is presented. The Cu6Sn5 …