Effective thermal management is quite urgent for electronics owing to their ever-growing
integration degree, operation frequency and power density, and the main strategy of thermal …

With the advances of the electronics industry, the continuing trend of miniaturization and
integration imposes challenges of efficient heat removal in nanoelectronic devices. Two …

Electronic devices play a vital role in our lives and are expected to play an even bigger role
in the future considering their immense contribution in every field. Current trends are drifting …

With the increasing integration of devices in electronics fabrication, there are growing
demands for thermal interface materials (TIMs) with high through-plane thermal conductivity …

Carbon is one of the basic elements for life on Earth. It exists in diverse allotropic forms while
being different in chemical and physical properties. The best well-known natural allotropes …

With the development of high frequency and high integration of electronics such as 5G
technology, overheating problem becomes an increasingly challenging problem. To address …

Flexible thermal conducting materials with the combination of excellent thermal conductivity
and mechanical strength are highly desired for many practical applications, but meeting this …

Due to low density, extremely high electrical and thermal conductivities, graphene has great
potential to construct lightweight thermal conductive paper for high‐power electric devices …

With the development of microelectronic technology, the demand of insulating electronic
encapsulation materials with high thermal conductivity is ever growing and much attractive …

Flexible insulating composites with superior thermal conductivity (usually below 5 W m− 1
K− 1 for the previously-reported composites) are highly desirable for further miniaturization …