(57) ABSTRACT A stacked die assembly for an IC includes a? rst interposer; a second
interposer; a? rst integrated circuit die, a second inte grated circuit die, and a plurality of …

An integrated circuit structure can include a first interposer and a second interposer. The first
interposer and the second interposer can be coplanar. The integrated circuit structure further …

An integrated circuit (IC) structure can include a first die and a second die. The second die
can include a first base unit and a second base unit. Each of the first base unit and the …

A semiconductor package structure includes a semiconductor substrate including a plurality
of through substrate vias (TSV) extending from a first surface to a second surface of the …

(57) ABSTRACT A semiconductor package includes a first semiconductor device, a second
semiconductor device vertically positioned above the first semiconductor device, and a …

(57) ABSTRACT A semiconductor package includes a first semiconductor element, an
insulating layer, and a second semiconductor element. The first semiconductor element …

A package substrate with embedded noise shielding walls is disclosed. One of the
embodiment comprises a signal line S sandwiched by a left shielding wall W1 and a right …

Semiconductor device components and methods are disclosed. In one embodiment, a
semiconductor device component includes a conductive segment having a first surface, a …

6,429,509 6,448,808 6,500,696 6,512,573 6,525.407 6,559,531 6,583,854 6,611,635
6,731,009 6,734,553 6,870,271 6,930,378 6,944,809 6,972.487 6,984,889 6,992.395 …

An apparatus for a monolithic integrated circuit die is disclosed. In this apparatus, the
monolithic integrated circuit die has a plurality of modular die regions. The modular die …