This paper investigates the effect of long term isothermal aging and thermal cycling on the
reliability of lead-free solder mixes with different solder compositions, PCB surface finishes …

The semiconductor and packaging industries have been moving away from the use of Lead
(Pb) due to the increasing awareness of the health and safety concerns surrounding its use …

The solder interconnections represent the weakest element in electronic assemblies. The
reliability of the solder joint is significantly affected by the mechanical bond formed between …

In electronic assemblies, quad flat package (QFP) is a widely used packaging method and
its interconnection structure degradation is an important field in electronic reliability …

Die-attachment, as the first level of electronics packaging, plays a key role for the overall
performance of the power electronics packages. Nanosilver sintering has becoming an …

We propose a physics-informed machine learning framework for solder materials design
and reliability prediction for electronics. It includes a comprehensive set of factors that impact …

In this experiment, the thermal shock performance of various doped Pb-free solder pastes on
Ball Grid Array (BGA) packages and resistors were observed in order to determine their …

Microelectronic assemblies used in automotive, military and defense applications may be
subjected to extreme high and extreme low temperature in addition to temperature cycling …

In this experiment, the thermal shock performance of various doped Pb-free solder pastes on
Ball Grid Array (BGA) packages and resistors were observed in order to determine their …