Optical wafer and die probe testing
MB McShane, PH Pelley, TA Stephens - US Patent 9,261,556, 2016 - Google Patents
An optical die probe wafer testing circuit arrangement and associated testing methodology
are described for mounting a production test die (157) and surrounding scribe grid (156) to a …
are described for mounting a production test die (157) and surrounding scribe grid (156) to a …
Die stack with optical TSVs
PH Pelley, TA Stephens, MB McShane - US Patent 9,094,135, 2015 - Google Patents
6,477,303 6,556,285 6,650,810 6,686,993 6,690,845 6,753,037 6,765,396 6,813,584
6,850,081 6,897,663 6,909,830 6,936,491 6,950,570 6,999,651 7,016,564 7,020,363 …
6,850,081 6,897,663 6,909,830 6,936,491 6,950,570 6,999,651 7,016,564 7,020,363 …
Communication system die stack
TA Stephens, PH Pelley, MB McShane - US Patent 9,091,820, 2015 - Google Patents
A high density, low power, high performance information system, method and apparatus are
described in which perpendicularly oriented processor and memory die stacks (130, 140 …
described in which perpendicularly oriented processor and memory die stacks (130, 140 …
Optical backplane mirror
TA Stephens, PH Pelley, MB McShane - US Patent 9,810,843, 2017 - Google Patents
Primary Examiner—Jerry Blevins (57) ABSTRACT An integrated circuit optical backplane
die and associated semiconductor fabrication process are described for forming optical …
die and associated semiconductor fabrication process are described for forming optical …
Integration of a MEMS beam with optical waveguide and deflection in two dimensions
TA Stephens, PH Pelley, MB McShane - US Patent 9,435,952, 2016 - Google Patents
A high density, low power, high performance information system, method and apparatus are
described in which an integrated circuit apparatus includes a plurality of deflectable MEMS …
described in which an integrated circuit apparatus includes a plurality of deflectable MEMS …
Optical redundancy
PH Pelley, TA Stephens, MB McShane - US Patent 9,766,409, 2017 - Google Patents
A high density, low power, high performance information system, method and apparatus are
described in which an integrated circuit apparatus includes a first integrated circuit link …
described in which an integrated circuit apparatus includes a first integrated circuit link …
Method and apparatus for beam control with optical MEMS beam waveguide
PH Pelley - US Patent 9,442,254, 2016 - Google Patents
A high density, low power, high performance information system, method and apparatus are
described in which perpendicularly oriented processor and memory die stacks (130, 140 …
described in which perpendicularly oriented processor and memory die stacks (130, 140 …
Light turning mirrors for hybrid integration of SiON-based optical waveguides and photo-detectors
F Civitci, G Sengo, A Driessen, M Pollnau… - Optics express, 2013 - opg.optica.org
For hybrid integration of an optical chip with an electronic chip containing photo-diodes and
processing electronics, light must be coupled from the optical to the electronic chip. This …
processing electronics, light must be coupled from the optical to the electronic chip. This …
Optical die test interface with separate voltages for adjacent electrodes
MB McShane, PH Pelley, TA Stephens - US Patent 10,230,458, 2019 - Google Patents
An integrated circuit optical die test interface and associated testing method are described
for using scribe area optical mirror structures (106) to perform wafer die tests on MEMS …
for using scribe area optical mirror structures (106) to perform wafer die tests on MEMS …