In this investigation, the chip-last, redistribution-layer (RDL)–first, fan-out panel-level
packaging (FOPLP) for heterogeneous integration is studied. Emphasis is placed on the …

This paper presents three-dimensional simulations of deep reactive ion etching processes,
also known as Bosch processes. A Monte Carlo method, accelerated by ray tracing …

The simulation of semiconductor manufacturing steps allows for a better understanding of
the underlying physics as well as for process optimizations, without the need for costly …

An atomisitic etching model is combined with a continuum concentration solver in order to
realistically simulate various effects during Deep Reactive Ion Etching (DRIE or the Bosch …

We combine the particle swarm optimization (PSO) method and the continuous cellular
automaton (CCA) in order to simulate deep reactive ion etching (DRIE), also known as the …

Deep reactive ion etching (DRIE) technique is a new and powerful tool in Micro-Electro-
Mechanical Systems (MEMS) fabrication. A 3-D DRIE simulation can help researcher …

An ongoing problem facing all companies is how to continuously satisfy customers.
Customer satisfaction has been generally determined to be an indicator utilized by …

This paper introduces an integrated 3-D simulation and visualization environment for
Micro/Nano fabrication processes. From the nanostructures in several hundred nanometers …

A novel aluminum oxide (Al2O3) hard mask fabrication process with nanoscale resolution is
introduced in this work. The Al2O3 mask can be used for various purposes, and in this thesis …

In this paper, we present an IP (Intellectual Property) library-based general and visualized
MEMS device simulation and verification tool in order to solve the problem that: 1. inaccurate …