[图书][B] Metalorganic vapor phase epitaxy (MOVPE): Growth, materials properties, and applications
S Irvine, P Capper - 2019 - books.google.com
Systematically discusses the growth method, material properties, and applications for key
semiconductor materials MOVPE is a chemical vapor deposition technique that produces …
semiconductor materials MOVPE is a chemical vapor deposition technique that produces …
Post-Chemical Mechanical Planarization Cleaning Technology
J Hazarika, A Gupta… - ECS Journal of Solid State …, 2023 - iopscience.iop.org
Chemical mechanical planarization (CMP), a commonly employed process for attaining
local and global planarization in integrated circuits fabrication, leaves contaminants and …
local and global planarization in integrated circuits fabrication, leaves contaminants and …
Effect of ammonium halide salts on wet chemical nanoscale etching and polishing of InGaAs surfaces for advanced CMOS devices
S Samanta, S Jin, CH Lee, SS Lee, H Struyf… - Materials Science in …, 2023 - Elsevier
Wet surface treatment of InGaAs is crucial for high-performance complementary metal-oxide
semiconductor (CMOS) devices as it reduces material loss and oxide formation in the …
semiconductor (CMOS) devices as it reduces material loss and oxide formation in the …
Post-CMP cleaning of InGaAs surface for the removal of nanoparticle contaminants for Sub-10nm device applications
IC Choi, HT Kim, NP Yerriboina, JH Lee… - ECS Journal of Solid …, 2019 - iopscience.iop.org
In this study, the development of post-chemical mechanical polishing (CMP) protocols for
cleaning abrasive nanoparticles from In 0.53 Ga 0.47 As surfaces was systematically …
cleaning abrasive nanoparticles from In 0.53 Ga 0.47 As surfaces was systematically …
Monolithic III/V integration on (001) Si substrate
B Kunert, K Volz - Metalorganic Vapor Phase Epitaxy (MOVPE) …, 2019 - Wiley Online Library
This chapter is about the up‐to‐date epitaxial growth of III/V heterostructures on (001) Si
substrates and what integration methods have been explored in the recent years. It focuses …
substrates and what integration methods have been explored in the recent years. It focuses …
Thin Ferrite Wafer Uniformly Polished with Magnetic Attraction Method
J Wang, L Ou, P Hu, G Wang - … Journal of Solid State Science and …, 2020 - iopscience.iop.org
When a ferrite substrate is used to prepare thin-film InSb Hall element chips, one surface of
the ferrite wafer needs to be polished. The traditional chemical mechanical polishing (CMP) …
the ferrite wafer needs to be polished. The traditional chemical mechanical polishing (CMP) …