Recent advances in the optimization of evaporator wicks of vapor chambers: From mechanism to fabrication technologies

X Cheng, G Yang, J Wu - Applied Thermal Engineering, 2021 - Elsevier
For the challenge of cooling hotspots in the burgeoning electronics/optoelectronics
equipment, vapor chambers provide a promising solution based on a distinctive passive two …

3D printing of aluminum alloys using laser powder deposition: a review

A Wang, H Wang, Y Wu, H Wang - The International Journal of Advanced …, 2021 - Springer
Laser powder deposition (LPD), as one of the most widely used additive manufacturing
methods for metals, is an important rapid prototype manufacturing and repairing method for …

High-efficiency cooling via the monolithic integration of copper on electronic devices

T Gebrael, J Li, AR Gamboa, J Ma, J Schaadt… - Nature …, 2022 - nature.com
Electrification is critical to decarbonizing society, but managing increasing power
densification in electrical systems will require the development of new thermal management …

Multi-objective optimization of a chip-attached micro pin fin liquid cooling system

V Radmard, Y Hadad, S Rangarajan, CH Hoang… - Applied Thermal …, 2021 - Elsevier
This study explores heat transfer from a chip-attached micro pin fin cooling device
undergoing water jet impingement where the silicon chip is in direct contact with the cooling …

One-step additive manufacturing and microstructure evolution of melt-grown Al2O3/GdAlO3/ZrO2 eutectic ceramics by laser directed energy deposition

H Liu, H Su, Z Shen, D Zhao, Y Liu, Y Guo… - Journal of the European …, 2021 - Elsevier
Synchronized-powder-feeding-based laser directed energy deposition (LDED) has great
application potential for the rapid fabrication of large-scale composite ceramics with complex …

A Review of Recent Developments in “On-Chip” Embedded Cooling Technologies for Heterogeneous Integrated Applications

S Rangarajan, SN Schiffres, B Sammakia - Engineering, 2023 - Elsevier
The electronics packaging community strongly believes that Moore's law will continue for
another few years due to recent technological efforts to build heterogeneously integrated …

A novel microchannel-twisted pinfin hybrid heat sink for hotspot mitigation

W Raza, D Ansari, JH Jeong, A Samad… - Applied Thermal …, 2024 - Elsevier
Thermal hotspots cause excessive localized temperature rise, leading to significant
temperature gradients across the microprocessor, which is the primary reason for its …

Shape optimization of hotspot targeted micro pin fins for heterogeneous integration applications

N Fallahtafti, S Rangarajan, Y Hadad, C Arvin… - International Journal of …, 2022 - Elsevier
In the field of high-performance computing (HPC), growing power demands makes
Heterogeneous Integration (HI) the future of next-generation computing systems to sustain …

Photochemistry with Cyanines in the Near Infrared: A Step to Chemistry 4.0 Technologies

B Strehmel, C Schmitz, K Cremanns… - Chemistry–A European …, 2019 - Wiley Online Library
Cyanines covering the absorption in the near infrared (NIR) are attractive for distinct
applications. They can interact either with lasers exhibiting line‐shaped focus emitting at …

Chemical species mixing during direct energy deposition of bimetallic systems using titanium and dissimilar refractory metals for repair and biomedical applications

J Shinjo, C Panwisawas - Additive Manufacturing, 2022 - Elsevier
Direct energy deposition (DED) is one of the additive manufacturing technologies where the
metal powder is laser-melted by the nozzle and then deposited onto the metal substrate …