High-k Gate Dielectrics for Emerging Flexible and Stretchable Electronics

B Wang, W Huang, L Chi, M Al-Hashimi… - Chemical …, 2018 - ACS Publications
Recent advances in flexible and stretchable electronics (FSE), a technology diverging from
the conventional rigid silicon technology, have stimulated fundamental scientific and …

Growth, dielectric properties, and memory device applications of ZrO2 thin films

D Panda, TY Tseng - Thin Solid Films, 2013 - Elsevier
In the advancement of complementary metal-oxide-semiconductor device technology, SiO2
was used as an outstanding dielectric and has dominated the microelectronics industry for …

Microwave dielectric properties of zirconia fabricated using NanoParticle Jetting™

Y Oh, V Bharambe, B Mummareddy, J Martin… - Additive …, 2019 - Elsevier
Additive manufacturing of ceramics has been actively investigated with the objective of
fabricating complex structures that compete in terms of material performance with …

Effect of postdeposition annealing on the thermal stability and structural characteristics of sputtered HfO2 films on Si (1 0 0)

G He, M Liu, LQ Zhu, M Chang, Q Fang, LD Zhang - Surface Science, 2005 - Elsevier
The thermal stability and structural characteristics for gate stack structure of HfO2 dielectrics
grown by DC reactive magnetron sputtering were investigated. The structural characteristics …

Integrations and challenges of novel high-k gate stacks in advanced CMOS technology

G He, L Zhu, Z Sun, Q Wan, L Zhang - Progress in Materials Science, 2011 - Elsevier
Due to the limitations in conventional complementary metal–oxide–semiconductor (CMOS)
scaling technology in recent years, innovation in transistor structures and integration of …

Research progress on dielectric properties of PU and its application on capacitive sensors and OTFTs

S Liu, R Duan, S He, H Liu, M Huang, X Liu… - Reactive and Functional …, 2022 - Elsevier
With the continuous development and progress of flexible electronic technology, the
flexibility requirements are becoming more and more stringent for each device component …

Yttria-stabilized zirconia thin films by pulsed laser deposition: Microstructural and compositional control

S Heiroth, T Lippert, A Wokaun, M Döbeli… - Journal of the European …, 2010 - Elsevier
The ns-laser ablation characteristics of tetragonal 3YSZ versus cubic 8YSZ have been
investigated to minimize a transfer of particulates in the pulsed laser deposition process …

An overview of conventional and new advancements in high kappa thin film deposition techniques in metal oxide semiconductor devices

P Devaray, SFWM Hatta, YH Wong - Journal of Materials Science …, 2022 - Springer
In the last three decades, study has seen the evolution of metal oxide semiconductor (MOS)
devices as device geometries have shrunk in line with Moore's law. This device shrunk …

Laser ablation characteristics of yttria-doped zirconia in the nanosecond and femtosecond regimes

S Heiroth, J Koch, T Lippert, A Wokaun… - Journal of applied …, 2010 - pubs.aip.org
The laser ablation characteristics of yttria-stabilized zirconia (YSZ) have been investigated
as a function of the target microstructure and dopant level for different nanosecond-[ArF, KrF …

Method of forming high-k dielectric films based on novel titanium, zirconium, and hafnium precursors and their use for semiconductor manufacturing

N Blasco, C Dussarrat - US Patent 8,399,056, 2013 - Google Patents
US8399056B2 - Method of forming high-k dielectric films based on novel titanium, zirconium,
and hafnium precursors and their use for semiconductor manufacturing - Google Patents …