Degradation, damage evolution, and fatigue models in the literature for various engineering
materials, mostly metals and composites, are reviewed. For empirical models established …

Owing to their superior electrical, thermal, and mechanical properties, solder joints are the
most widely used interconnection materials in electronic product packaging. Because the …

As the trend in requirements of electronic packaging is toward higher I/O, greater
performance, higher density, and lighter weight, the use of area array packaging technology …

This paper presents the entropic damage indicators for metallic material fatigue processes
obtained from three associated energy dissipation sources. Since its inception, reliability …

Microstructural length scales are relatively large in typical soldered connections. A
microstructure which is continuously evolving is known to have a strong influence on …

A thermomechanical fatigue life prediction model based on the theory of damage mechanics
is presented. The damage evolution, corresponding to the material degradation under cyclic …

In this paper, a new method is proposed for evaluating the high-cycle fatigue strength of
BGA (Ball Grid Array) packages with Pb-free solder and Pb–Sn solder due to vibration. An …

In this paper, the tin-lead (Sn-37wt% Pb) eutectic solder joints of plastic ball grid array
(PBGA) assemblies are tested using temperature cycling, random vibrations, and combined …

Due to the coefficient of thermal expansion (CTE) mismatch between the bonded layers, the
solder joint experiences cycling shear strain, which leads to short cycle fatigue. When …

Recent trends in reliability and fatigue life analysis of electronic devices have involved
developing structural integrity models for predicting the operating lifetime under vibratory …