As a critical energy-conversion system component, power semiconductor modules and their
layout optimization has been identified as a crucial step in achieving the maximum …

In this investigation, the chip-last, redistribution-layer (RDL)–first, fan-out panel-level
packaging (FOPLP) for heterogeneous integration is studied. Emphasis is placed on the …

Recent studies in power electronic design automation have introduced various models for
parasitic extraction of multichip power module layouts. However, none of these studies …

Recent developments in EDA tools for power electronics modules have led to simultaneous
analysis and optimization of package features with regard to electro-thermal and thermo …

Simulating time-domain applications with multi-chip power modules requires estimating the
module's internal package impedances. This is especially true for modules designed with …

Broadband electromagnetic (EM) modeling increases in importance for virtual prototyping of
advanced power electronics systems (PES), enabling a more accurate prediction of fast …

Electrical parasitics, especially parasitic inductance, play an essential role in enhancing
power module design performance through reducing voltage overshoot and switching …

In the last few years, design automation for multi-chip power modules (MCPMs) has become
a trending research topic in the power electronics community. Many different re-search …

Multi-chip power module (MCPM) layout design automation has been identified as one of
the primary research interests in the power electronics community with the advent of wide …

With the on-going trend of electrification of transport, ultra-high-density power electronics
with advanced 2.5 D and 3D packaging are drawing attention. At present, the power module …