Aiming for a suitable die-attached substrate for Ag-sintered joint technology during harsh
operating environment, three surface finishes of sputtered Ti/Ag-layers, electroless Ni-/Pt-/Ag …

Power modules applied in offshore applications are facing risks of corrosion failures on die-
attach materials due to high humidity and H 2 S exposure. To investigate such corrosion …

Here, we demonstrate that pristine CDs, obtained from amine-containing precursors, were
available for the curing of epoxy monomers. The optical properties and the surface chemical …

Pressureless sinter-joining of cost-effective micron-Ag flake pastes at temperatures below
200° C poses significant challenges due to their poor surface activity and low tapped …

In this contribution, the impact of graphene oxide (GO) with different oxidation degrees on
the cryogenic mechanical properties of GO/epoxy nanocomposites is investigated. GO …

Polyetherketoneketone (PEKK) is an alternative material for use in removable partial
denture frameworks; these frameworks must exhibit antibacterial properties to reduce the …

Abstract An Ag–Au joint developed by Ag paste joining on electroless nickel/electroless
palladium/immersion gold (ENEPIG)-plated direct-bonded aluminum (DBA) substrate was …

Copper–silver (Cu–Ag) core–shell nanoparticles are promising for replacing the silver
particles and flakes used in printed conductors in current solar cells since they deliver good …

In order to achieve superior interfacial heat dissipation, large-area (≥ 400 mm 2) sintering of
a novel nanosilver paste at ultralow temperature (180° C) was successfully realized using …

Abstract Effect of in situ formed silver nanoparticles doping on electrorheological response
of highly porous chitosan particles in suspensions of polydimethylsiloxane (silicone oil) is …