The future of solid-state lighting relies on how the performance parameters will be improved
further for developing high-brightness light-emitting diodes. Eventually, heat removal is …

In this study, the heat dissipation efficiencies of high power multi-chip COB (Chip-on-Board)
LEDs with five different chip gaps were compared by assessing their junction temperature …

Heat transfer is crucial to the fabrication of high efficiency light emitting diode (LED)
packages. The effectiveness of the heat transfer depends on the package materials and …

A novel columnar heat pipe (CHP) leadframe for high power LED device was developed. 42
high power LED chips were mounted on its surface directly. The thermal performance …

In this study, effects of the dimensions and the thermal conductivity of the substrate on the
heat transfer characteristics of a LED module are investigated. The total thermal resistance …

Pores formed during the sintering of a glass/phosphor mixture affect the scattering and path
of light within the resulting phosphor-in-glass (PIG) plate. An investigation of the interactions …

This paper reports on the dissipation of heat generated by a high power LED array using
piezoelectric fans. Both numerical and experimental studies were carried out to evaluate the …

The definition of technical specifications and the corresponding laboratory procedures are
necessary steps in order to assure the quality of the devices prior to be installed in Solar …

This paper reports on the enhancement of the heat transfer in high power LEDs by a
combination of piezoelectric fans and a heat sink. Experimental and numerical studies were …

Group III-nitride light-emitting diodes (LEDs) fabricated on sapphire substrates typically
suffer from insufficient heat dissipation, largely due to the low thermal conductivities (TCs) of …