Thermal management and packaging of wide and ultra-wide bandgap power devices: a review and perspective
Power semiconductor devices are fundamental drivers for advances in power electronics,
the technology for electric energy conversion. Power devices based on wide-bandgap …
the technology for electric energy conversion. Power devices based on wide-bandgap …
Enhanced copper anticorrosion from Janus-doped bilayer graphene
The atomic-thick anticorrosion coating for copper (Cu) electrodes is essential for the
miniaturisation in the semiconductor industry. Graphene has long been expected to be the …
miniaturisation in the semiconductor industry. Graphene has long been expected to be the …
High Thermal Conductivity of Sandwich‐Structured Flexible Thermal Interface Materials
Thermal interfaces are vital for effective thermal management in modern electronics,
especially in the emerging fields of flexible electronics and soft robotics that impose …
especially in the emerging fields of flexible electronics and soft robotics that impose …
Ultrahigh-performance solid-solid phase change material for efficient, high-temperature thermal energy storage
S Li, L He, H Lu, J Hao, D Wang, F Shen, C Song, G Liu… - Acta Materialia, 2023 - Elsevier
Thermal energy storage using phase change materials (PCMs) offers enormous potential for
regulation of unmatched energy supply and demand of renewable energy resources …
regulation of unmatched energy supply and demand of renewable energy resources …
Liquid‐Superspreading‐Boosted High‐Performance Jet‐Flow Boiling for Enhancement of Phase‐Change Cooling
Z Xu, P Zhang, C Yu, W Miao, Q Chang… - Advanced …, 2023 - Wiley Online Library
Enhanced boiling heat transfer via surface engineering is a topic of general interest for its
great demand in industrial fields. However, as a dynamic interfacial phenomenon, a deep …
great demand in industrial fields. However, as a dynamic interfacial phenomenon, a deep …
Ultrathin flexible heat pipes with Microsorum fortunei structural-like wick for cooling flexible electronic devices
Ultrathin flexible heat pipes (FHP) with Microsorum fortunei structural-like wicks were
fabricated to meet the cooling demands of flexible electronics. The biomimetic wick was …
fabricated to meet the cooling demands of flexible electronics. The biomimetic wick was …
An adaptive thermal management method via bionic sweat pores on electronic devices
L Yu, B Jiao, Y Ye, X Du, Y Kong, R Liu, J Qiao… - Applied Thermal …, 2024 - Elsevier
Maintaining proper operation temperature is a basial need for electronic devices. However,
the current thermal management strategy for electronic devices generally provides a fixed …
the current thermal management strategy for electronic devices generally provides a fixed …
Perspectives on superhydrophobic surface durability
Superhydrophobicity is a remarkable adaptation observed in various natural surfaces, which
can potentially play a crucial role in the efficient functioning of numerous applications. The …
can potentially play a crucial role in the efficient functioning of numerous applications. The …
3D graphene-nanowire “sandwich” thermal interface with ultralow resistance and stiffness
Despite the recent advancements of passive and active cooling solutions for electronics,
interfaces between materials have generally become crucial barriers for thermal transport …
interfaces between materials have generally become crucial barriers for thermal transport …
Liquid metal compartmented by polyphenol‐mediated nanointerfaces enables high‐performance thermal management on electronic devices
C Zhang, Y Tang, T Guo, Y Sang, D Li, X Wang… - InfoMat, 2024 - Wiley Online Library
The exponentially increasing heat generation in electronic devices, induced by high power
density and miniaturization, has become a dominant issue that affects carbon footprint, cost …
density and miniaturization, has become a dominant issue that affects carbon footprint, cost …