Thermal management and packaging of wide and ultra-wide bandgap power devices: a review and perspective

Y Qin, B Albano, J Spencer, JS Lundh… - Journal of physics D …, 2023 - iopscience.iop.org
Power semiconductor devices are fundamental drivers for advances in power electronics,
the technology for electric energy conversion. Power devices based on wide-bandgap …

Enhanced copper anticorrosion from Janus-doped bilayer graphene

M Zhao, Z Zhang, W Shi, Y Li, C Xue, Y Hu… - Nature …, 2023 - nature.com
The atomic-thick anticorrosion coating for copper (Cu) electrodes is essential for the
miniaturisation in the semiconductor industry. Graphene has long been expected to be the …

High Thermal Conductivity of Sandwich‐Structured Flexible Thermal Interface Materials

L Jing, R Cheng, M Tasoglu, Z Wang, Q Wang, H Zhai… - Small, 2023 - Wiley Online Library
Thermal interfaces are vital for effective thermal management in modern electronics,
especially in the emerging fields of flexible electronics and soft robotics that impose …

Ultrahigh-performance solid-solid phase change material for efficient, high-temperature thermal energy storage

S Li, L He, H Lu, J Hao, D Wang, F Shen, C Song, G Liu… - Acta Materialia, 2023 - Elsevier
Thermal energy storage using phase change materials (PCMs) offers enormous potential for
regulation of unmatched energy supply and demand of renewable energy resources …

Liquid‐Superspreading‐Boosted High‐Performance Jet‐Flow Boiling for Enhancement of Phase‐Change Cooling

Z Xu, P Zhang, C Yu, W Miao, Q Chang… - Advanced …, 2023 - Wiley Online Library
Enhanced boiling heat transfer via surface engineering is a topic of general interest for its
great demand in industrial fields. However, as a dynamic interfacial phenomenon, a deep …

Ultrathin flexible heat pipes with Microsorum fortunei structural-like wick for cooling flexible electronic devices

Y Sun, F Liang, H Tang, Y Tang, S Zhang… - International Journal of …, 2023 - Elsevier
Ultrathin flexible heat pipes (FHP) with Microsorum fortunei structural-like wicks were
fabricated to meet the cooling demands of flexible electronics. The biomimetic wick was …

An adaptive thermal management method via bionic sweat pores on electronic devices

L Yu, B Jiao, Y Ye, X Du, Y Kong, R Liu, J Qiao… - Applied Thermal …, 2024 - Elsevier
Maintaining proper operation temperature is a basial need for electronic devices. However,
the current thermal management strategy for electronic devices generally provides a fixed …

Perspectives on superhydrophobic surface durability

MJ Hoque, J Ma, KF Rabbi, X Yan, BP Singh… - Applied Physics …, 2023 - pubs.aip.org
Superhydrophobicity is a remarkable adaptation observed in various natural surfaces, which
can potentially play a crucial role in the efficient functioning of numerous applications. The …

3D graphene-nanowire “sandwich” thermal interface with ultralow resistance and stiffness

L Jing, R Cheng, R Garg, W Gong, I Lee, A Schmit… - ACS …, 2023 - ACS Publications
Despite the recent advancements of passive and active cooling solutions for electronics,
interfaces between materials have generally become crucial barriers for thermal transport …

Liquid metal compartmented by polyphenol‐mediated nanointerfaces enables high‐performance thermal management on electronic devices

C Zhang, Y Tang, T Guo, Y Sang, D Li, X Wang… - InfoMat, 2024 - Wiley Online Library
The exponentially increasing heat generation in electronic devices, induced by high power
density and miniaturization, has become a dominant issue that affects carbon footprint, cost …