$15-mumathrm {m} $-pitch Cu/Au interconnections relied on self-aligned low-temperature thermosoni...

Low-temperature ultrasonic bonding of Cu/Sn microbumps with au layer for high density interconnection applications

Q Zeng, Y Guan, J Chen, Y Jin - 2017 IEEE 67th Electronic …, 2017 - ieeexplore.ieee.org
Flip-chip bonding has become an efficient method to realize fine-pitch interconnection in
high density interconnection applications. Thermal-compression bonding of Cu/Sn …
被引用次数：2 相关文章 所有 3 个版本

High-precision integration approach based on alignment maintaining flip-chip bonding using cone shaped bump and truncated pyramid pad

BT Tung, L Ma, T Amano, K Kikuchi… - … Conference on Optical …, 2014 - ieeexplore.ieee.org
In this paper, a high-precision heterogeneous integration approach based on a high
alignment accuracy flip-chip bonding using nanoparticle deposition (NpD) cone shaped …
相关文章 所有 3 个版本