This paper introduces a novel approach to address thermal management challenges in
system-in-package (SiP) technology, which is a significant concern in various advanced …

The basic need common to all living beings is water. Less than 1% of the water on earth is
fresh water and water use is increasing daily. Agricultural practices alone require huge …

The rapid development of power electronics has challenged the thermal integrity of
semiconductor packaging. Further developments in this domain can be supported …

This paper proposes a real-time thermal monitoring method using embedded integrated
sensor interfaces dedicated to industrial integrated system applications. Industrial sensor …

We present in this paper a new modified version of the System-in-Package (SiP) model
based on three-layer chips. The idea is to add copper layers permitting to take up its thermal …

The reliability and lifetime of systems-on-chip (SoCs) are being seriously threatened by
thermal issues. In modern SoCs, dynamic thermal management (DTM) uses the thermal …

This article presents the simulation, validation and implementation of a temperature sensor
based on RO (Ring Oscillator) in order to carry out a thermal study for the detection and …

It is well known that Field Programmable Gate Arrays (FPGA) are good platforms for
implementing embedded systems because of their configurable nature. However, the …

The LabPET II detection module serves as the fundamental component within Positron
Emission Tomography (PET) scanners designed for achieving ultra-high-resolution imaging …

Purpose The purpose of this paper is to investigate a more robust ring oscillator. Less
sensitivity to power supply variations is a target. This is important since low-quality ring …