Electronic devices using semiconductors such as insulated-gate bipolar transistors, metal-
oxide-semiconductor field-effect transistors, and diodes are extensively used in electrical …

This paper aims to examine the thermomechanical response of sintered silver die
attachments in power electronics using finite element analysis (FEA). In this work, several …

The increasing demand in automotive markets is leading the semiconductor industries to
develop high-performance and highly reliable power devices. Silicon carbide MOSFET …

Finite element analysis (FEA) is perhaps the most popular technique used for simulating the
thermally induced failures of sintered silver die attachments in power electronics. The …

This paper discusses the design for reliability of a sintered silver structure in a power
electronic module based on the computational approach that composed of high fidelity …

Integration of more functionality and smaller chips into decreasing package volume leads to
increasing heat generation. In addition, the use of new compound semiconductors like SiC …

The massive development of Hybrid and Electrical Vehicles (HEV) is strongly impacting the
semiconductor industry demanding for highly reliable Power Electronic components. Within …

This work presents an integrated experimental–numerical method to characterize, model,
and experimentally study the properties of transfer molded power modules, considering two …

In this paper an overview on Power Packages challenges and technology approaches is
given. These challenges mainly originate from Silicon Carbide MOSFETs superior …

Effects of pressurization and thermal-processing conditions on the deformation properties of
sintered-silver sheets, excluding the contribution of the voids,(hereinafter, referred to as …