Electronics industry is one of the fastest evolving, innovative, and most competitive
industries. In order to meet the high consumption demands on electronics components …

Inspection reliability of small-scale defects, targeting dimensions below 100 µm, is crucial for
structural safety of critical components in high-value applications. Early defects are often …

In upcoming years, the number of Internet-of-Things (IoT) devices is expected to surge up to
tens of billions of physical objects. However, while the IoT is often presented as a promising …

Abstract Scanning Acoustic Microscopy (SAM) is shown here for the first time to be suitable
for the visualization of defects like electrolyte leakage, faulty electrodes and gas …

Visually inspecting integrated circuit (IC) wire bonding defects is important to ensuring the
product quality after the packaging process. The availability of IC X-ray images offers an …

The main aim of this paper is to provide the feasibility of non-destructive testing (NDT)
method, such as scanning acoustic microscopy (SAM), for damage detection in ultrasound …

Terahertz radiation for inspection and fault detection has been of interest for the
semiconductor industry since the first generation and detection of THz signals. Until recent …

Integrated circuit plays an important role in the information technology industry. Surface
defect inspection of IC packages is an essential process in the IC packaging manufacturing …

The photo-thermoelectric (PTE) effect in electronic materials effectively combines photo-
absorption-induced local heating and associated thermoelectric conversion for uncooled …

This paper reviewed the state-of-art copper pillar technology in flip-chip packaging, driven
by the semiconductor industry's demands for thinner and faster data transmission. This …