The main motivation of this review is to study the evolution of first and second level of
interconnect materials used in memory device semiconductor packaging. Evolutions of …

Purposes To review the uses of AI for magnetic resonance (MR) imaging assessment of
primary pediatric cancer and identify common literature topics and knowledge gaps. To …

Chapter 1 gives an introduction to Cu wire bonding technology. The advantages of Cu over
Au, such as lower cost, higher mechanical strength, and higher electrical and thermal …

Commercially pure copper was joined to a 1050 aluminum alloy by friction stir welding. A
specific configuration where the tool pin was fully located in the aluminum plate was chosen …

Morphology and microstructure of dislocation etch pits in GaN epilayers etched by molten
KOH have been investigated by atomic force microscopy, scanning electron microscopy …

Copper wire bonding of microelectronic parts has developed as a means to cut the costs of
using the more mature technology of gold wire bonding. However, with this new technology …

The interfacial microstructures of the Cu-wire bonding to an Al pad are investigated first by
using an X-ray microdiffractometer and high-resolution transmission electron microscopy. It …

In high power automotive electronics copper wire bonding is regarded as the most
promising alternative for gold wire bonding in 1st level interconnects and therefore …

The objective of this review is to study the evolution and key findings and critical technical
challenges, solutions and future trend of bonding wires used in semiconductor electronics …

Advances in joining processes for aluminum and copper are sought after to facilitate the
greater adoption of aluminum in electrical applications. Aluminum's chemical affinity to …