The main focus of the work is on developing a new class of hybrid composite with polyester
as the continuous phase and micro-sized hexagonal boron nitride (hBN) and short sisal fibre …

Electromagnetic interference (EMI) shielding materials with low reflection and excellent
thermal conduction are vitally important for sophisticated devices and next-generation …

This study investigates the impact of Ultra-High Vacuum (UHV) Thermal annealing in a
N₂/O₂ atmosphere on the passivation of Ar ion etched crystalline silicon (c-Si) surfaces. A …

Efficient heat dissipation is essential to further improve the integration of high-power
electronic packaging devices. Three-dimensional BN networks with high-density thermal …

High thermally conductive polymer composites have garnered significant attention due to
their exceptional performance, given the ever‐decreasing size of electronic devices and the …

Graphite/SiC (GSC) thin films were synthesized on silicon substrates via a spray method,
depositing a Si-graphite solution on preheated silicon samples at 350 C, followed by …

Nanocomposites of poly (vinylidene fluoride) PVDF with graphene nanoflakes (GNF) were
prepared using two different routes. Initially, a mix-melting method was used to prepare …

The Special Issue of Nanomaterials,“Highly Thermal Conductive Nanocomposites”, focuses
on the application of different types of thermal conductivity nanocomposites in thermal …

2. 中国科学院上海硅酸盐研究所信息功能材料与器件研究中心, 上海201899) 摘要:
针对高功率器件, 高密度封装等微波通信领域对高性能微波复合基板的迫切需求 …

The study explores the pressureless sintering (PS) and chemical compatibility of ZrB 2-30
vol.% SiC produced by additive manufacturing (AM) with CO 2. The oxidation kinetics and …