Embedded systems must address a multitude of potentially conflicting design constraints
such as resiliency, energy, heat, cost, performance, security, etc., all in the face of highly …

Ensuring lifetime reliability of microprocessors has become more critical. Continuous scaling
and increasing temperatures due to growing power density are threatening lifetime …

Continuous technology scaling has made aging mechanisms such as Negative Bias
Temperature Instability (NBTI) and electromigration primary concerns in Network-on-Chip …

We present a new architecture level unified reliability evaluation methodology for chip
multiprocessors (CMPs). The proposed reliability estimation (REST) is based on a Monte …

Network-on-Chip (NoC) architectures have emerged as a better replacement of the
traditional bus-based communication in the many-core era. However, continuous technology …

Embodiments of a method and system are disclosed. One embodiment of an integrated
circuit device is disclosed. The integrated circuit device includes first and second processor …

Negative-Bias Temperature Instability seriously affects nanoscale circuits reliability and
performance. Continuous stress and increasing operating temperatures lead to device …

As device feature sizes continue to shrink, long-term reliability such as Negative Bias
Temperature Instability (NBTI) leads to low yields and short mean-time-to-failure (MTTF) in …

We investigate dynamic voltage and frequency scaling (DVFS) as a mechanism for dynamic
reliability management (DRM) of chip multiprocessors (CMPs). The proposed DRM scheme …

Three dimensional (3D) integration attempts to address challenges and limitations of new
technologies such as interconnect delay and power consumption. However, high power …