Transparent brittle materials such as glass and sapphire are widely concerned and applied
in consumer electronics, optoelectronic devices, etc. due to their excellent physical and …

With the advancement of glass technology in recent times, glass has become one of the
most important engineering materials in architectural, medical, automotive, flat panel …

We investigate the feasibility of cutting and drilling thin flex glass (TFG) substrates using a
picosecond laser operating at wavelengths of 1030 nm, 515 nm and 343 nm. 50 μm and 100 …

We present an optimization study on laser parameters for 3D micromachining of fused silica
to achieve critical goals for practical applications including high surface quality, high volume …

Carrier media plays a major role in removal of material in Abrasive Jet Machining (AJM). In
this paper, an attempt has been made to use hot air as carrier media in AJM. Modified …

Hybrid machining is a combination of conventional with the non-conventional process or two
non-conventional processes. In the present work, an attempt has been made to combine hot …

This study reports the investigation of the morphology of the surface damaged during the
laser scribing of glass and the analysis of the corresponding interaction mechanism …

Abrasive Jet Machining is becoming one of the most prominent machining techniques for
glass and other brittle materials. In this article, an attempt has been made to combine …

The trend towards using a large area of thin-film transistor liquid crystal display (TFT-LCD)
glass substrate introduces challenges for cutting quality and production yield. For the …

Manufacturing industry faces new challenges with the emergence of the need for the
production of small batches of personalized parts. Such production methods demand for a …