A novel reflow method with an additional temperature gradient (TG) was performed to
bonding single crystal (001) Cu and polycrystal Ni substrates with pure Sn as interlayer. The …

Recently, interest in power modules is increasing in eco-friendly mobility such as electric
vehicles (EVs) and fuel cell electric vehicles (FCEVs). The power module is a key …

A novel solid–liquid interdiffusion (SLID) bonding method with the assistance of temperature
gradient (TG) was carried out to bonding Cu and Ni substrates with Sn as interlayer. The …

Transient liquid phase bonding (TLPB) is a promising technology for three-dimensional
integration of circuits (3D IC), but it can be slow and less productive. A novel Cu-Sn …

Abstract Silver (Ag) and indium (In) are increasingly investigated as transient liquid phase
(TLP) bonding materials for die attachment in next generation power modules. In this study …

Much attention has been drawn to the Ni-Sn transient liquid phase (TLP) bonded joints for
high-temperature electronic packaging applications since their inception. A comparative …

Ag and In are increasingly being explored as interconnection materials for electronic
packaging. However, a deep understanding of their interfacial reaction is still lacking. This …

The growth of interfacial IMC in Cu/Sn/Cu and Cu/Sn-5.0 Ag/Cu micro solder joints and the
trace of Ag atoms migration in Cu/Sn-5.0 Ag/Cu micro solder joint during reflow with and …

In electronic packaging technology, intermetallic compounds (IMCs) formed during a reflow
process significantly affect the mechanical properties of the devices. In this study, In solder …

以BNi2 箔为中间层对TM52/Q235 异种材料进行瞬时液相扩散焊接(TLP),
研究了保温时间对接头界面组织, 力学性能和电化学性能的影响. 结果表明: TM52/Q235 …