The new packaging technologies used for gallium nitride (GaN) devices avoid wire bonds
and leads in order to completely utilize their switching performance. This also means that …

Enhancing power cycling capability of power semiconductor devices is highly demanded in
order to increase the long-term reliability of multilevel inverters. Ageing of power switches …

The reliability of power electronic devices and converters is closely related to thermal stress.
However, the research on insulated gate bipolar transistor (IGBT) heat balance in the …

The neutral-point-clamped (NPC) converter suffers from uneven power loss distribution
among semiconductor devices under the conventional modulation technique, which …

Advanced packaging technologies in Wide band gap devices like GaN avoid wire bonds
thereby making the solder joints more susceptible to thermo-mechanical fatigue. To limit the …

This paper investigates the power cycling lifetime of a three-phase three-level neutral-point-
clamped (NPC) inverter used in a 50-kVA adjustable speed drive (ASD). Considering the …

Research concerns have grown towards precede diagnosis and prognosis of faults in power
converters that result from thermal overheating problems of semiconductor devices. These …

The temperature fluctuations in the semiconductor devices within neutral-point clamped
(NPC) wind power converter during low-voltage ride-through operation would reduce the …

This paper presents the operation of a dual active bridge (DAB) converter using extended-
phase-shift (EPS) modulation with a focus on controlling the junction temperatures of the 1.2 …

As one of the most widely adopted topologies in power electronics, the H‐bridge circuit has
been used for numerous kinds of power converters. With the emphasis on reliability and …