Strengthening materials traditionally involves the controlled creation of internal defects and
boundaries so as to obstruct dislocation motion. Such strategies invariably compromise …

Copper is the most common interconnecting material in the field of microelectronic
packaging, which is widely used in advanced electronic packaging technologies. However …

Coherent twin boundaries (CTBs) are widely described, both theoretically and
experimentally, as perfect interfaces that play a significant role in a variety of materials …

Thin film catalysts, giving a different morphology, provide a significant advantage over
catalyst particles for the gas evolution reaction. Taking the advantages of sputter deposition …

We report on the synthesis of epitaxial (single-crystal-like), nanotwinned Cu films via
magnetron sputtering. Increasing the deposition rate from 1 to 4 nm/s decreased the …

A rotary electroplating system was used to fabricate high-strength nanotwinned copper (nt-
Cu) foils with slanted columnar grain structures, which may serve as the anode current …

The strengthening effect of twins in nanocrystalline metals has been reported both in
experiment and simulation. While twins are mostly considered as effective barriers to …

High-purity Cu samples containing parallel columns of highly aligned nanotwins separated
by coherent Σ3 twin boundaries (TBs) with median spacing of about 35 nm were subjected …

Near classical yield points were reproducibly observed at room and liquid nitrogen
temperatures during tensile deformation of 170μm thick, high-purity copper foils synthesized …

The remarkable properties of nanotwinned (NT) face-centered-cubic (fcc) metals arise
directly from twin boundaries, the structures of which can be initially determined by growth …