[HTML][HTML] Recent advances in nanomechanical and in situ testing techniques: Towards extreme conditions
Nanoindentation based techniques were significantly enhanced by continuous stiffness
monitoring capabilities. In essence, this allowed to expand from point-wise discrete …
monitoring capabilities. In essence, this allowed to expand from point-wise discrete …
[HTML][HTML] Advances and opportunities in high-throughput small-scale mechanical testing
The quest for novel materials used in technologies demanding extreme performance has
been accelerated by advances in computational materials screening, additive manufacturing …
been accelerated by advances in computational materials screening, additive manufacturing …
Neural network supported microscale in situ deformation tracking: a comparative study of testing geometries
Micro-and nanomechanical testing techniques have become an integral part of today's
materials research portfolio. Contrary to well-studied and majorly standardized …
materials research portfolio. Contrary to well-studied and majorly standardized …
[HTML][HTML] Microscopic fracture toughness of notched porous sintered Cu micro-cantilevers for power electronics packaging
To fulfill the high-temperature application requirement of high-power electronics packaging,
Cu nanoparticle sintering technology, with benefits in low-temperature processing and high …
Cu nanoparticle sintering technology, with benefits in low-temperature processing and high …
Computational analysis of the interfacial debonding in polymer composites: research progress and challenges
I Goda, E Padayodi, RN Raoelison - Advanced Composites and Hybrid …, 2024 - Springer
This paper presents a comprehensive review of the current state-of-the-art computational
modeling techniques for predicting debonding processes and interface failures in fiber …
modeling techniques for predicting debonding processes and interface failures in fiber …
Investigative characterization of delamination at TiW-Cu interface in low-temperature bonded interconnects
The trend for heterogeneous integration has driven the need for a low-temperature bonding
process. Cu-Sn-In based solid-liquid interdiffusion (SLID) bonding technology has been …
process. Cu-Sn-In based solid-liquid interdiffusion (SLID) bonding technology has been …
Strength determination for rough substrate-coating interfaces with three-dimensional defect structure
T Klünsner, M Krobath, R Konetschnik… - International Journal of …, 2023 - Elsevier
Quantitative information on the strength of interfaces between thin ceramic coatings and
their substrates is crucial when aiming to understand their failure behavior. Many technically …
their substrates is crucial when aiming to understand their failure behavior. Many technically …