The thermal mismatch between different components has been a serious issue in the
reliability of electronic products. The effect of epoxy molding compound (EMC) on the …

High-power insulated gate bipolar transistor (IGBT) modules are the key devices for energy
change and transmission. Reflow soldering process is a crucial process in IGBT module …

Excessive heat would reduce the service life and threaten the reliability of electronic
devices. To optimize the heat conduction in Fan-out (FO) package, we proposed a hybrid …

In 3D packaging memory devices, solder joints are critical links between the chip and the
printed circuit board (PCB). Under severe working conditions, cracks inevitably occur due to …

Epoxy molding compound (EMC) compositions of silica powder and epoxy matrix have been
utilized as encapsulation for semiconductor packaging over the past decades. Among …

The 2.5 D packaging technology is a high–performance method for electronic packaging.
This study addresses the reliability issues of 2.5 D packaging during the manufacturing …

The popularity of electronic devices used in a wide range of applications has significantly
increased over recent years. As a result, more and more power packages are needed …

5 D interposer technology has gotten a lot of attention as a viable solution to high IO density,
cost, and performance challenges. Glass is a potential choice as an interposer material in an …

Three-dimensional (3D) integration has become a leading approach in chip packaging. The
interconnection density and reliability of micro-bumps in chip stacking are often threatened …

In the last five decades, electronic package devices have evolved based on Moore's law,
which states that the number of transistors in dense integrated circuits doubles …