Full-chip thermal map estimation for commercial multi-core CPUs with generative adversarial learning

W Jin, S Sadiqbatcha, J Zhang, SXD Tan - Proceedings of the 39th …, 2020 - dl.acm.org
In this paper, we propose a novel transient full-chip thermal map estimation method for multi-
core commercial CPU based on the data-driven generative adversarial learning method. We …

Real-time full-chip thermal tracking: A post-silicon, machine learning perspective

S Sadiqbatcha, J Zhang, H Amrouch… - IEEE Transactions on …, 2021 - ieeexplore.ieee.org
In this article, we present a novel approach to real-time tracking of full-chip heatmaps for
commercial off-the-shelf microprocessors based on machine-learning. The proposed post …

Full-chip power density and thermal map characterization for commercial microprocessors under heat sink cooling

J Zhang, S Sadiqbatcha, M O'Dea… - … on Computer-Aided …, 2021 - ieeexplore.ieee.org
In this article, we address the problem of accurate full-chip power and thermal map
estimation for commercial off-the-shelf multicore processors. Processors operating with heat …

Real-time Thermal Map Estimation for AMD Multi-Core CPUs Using Transformer

J Lu, J Zhang, SXD Tan - 2023 IEEE/ACM International …, 2023 - ieeexplore.ieee.org
This paper presents a novel approach for real-time estimation of spatial thermal maps for the
commercial AMD Ryzen 7 4800U 8-core microprocessor using a transformer-based …

Post-silicon heat-source identification and machine-learning-based thermal modeling using infrared thermal imaging

S Sadiqbatcha, J Zhang, H Zhao… - … on Computer-Aided …, 2020 - ieeexplore.ieee.org
In this article, we present a novel post-silicon approach to locating the dominant heat
sources on commercial multicore processors using heatmaps measured via an infrared (IR) …

On mitigation of side-channel attacks in 3D ICs: Decorrelating thermal patterns from power and activity

J Knechtel, O Sinanoglu - Proceedings of the 54th Annual Design …, 2017 - dl.acm.org
Various side-channel attacks (SCAs) on ICs have been successfully demonstrated and also
mitigated to some degree. In the context of 3D ICs, however, prior art has mainly focused on …

Hierarchical memory system with STT-MRAM and SRAM to support transfer and real-time reinforcement learning in autonomous drones

I Yoon, MA Anwar, RV Joshi, T Rakshit… - IEEE Journal on …, 2019 - ieeexplore.ieee.org
This article presents a transfer learning (TL) followed by reinforcement learning (RL)
algorithm mapped onto a hierarchical embedded memory system to meet the stringent …

3-D stacked technology of DRAM-logic controller using through-silicon via (TSV)

WW Shen, YM Lin, SC Chen, HH Chang… - IEEE Journal of the …, 2018 - ieeexplore.ieee.org
This paper describes a four-layer-stacked chip with 45-nm dynamic random access memory
(DRAM) dice and 65-nm logic controller, which are interconnected by backside-via-last …

Steady-State temperature field prediction for FPGA chips with reduced number of temperature sensors

Y Guan, Y Ding, P Zhang, C Fan, J Cheng - Measurement, 2025 - Elsevier
Obtaining the steady-state temperature distribution of FPGA chip is the basis to build the
thermal monitoring mechanism for reliable system performance. Existing work employs the …

Learning based spatial power characterization and full-chip power estimation for commercial tpus

J Lu, J Zhang, W Jin, S Sachdeva… - 2023 28th Asia and …, 2023 - ieeexplore.ieee.org
In this paper, we propose a novel approach for the real-time estimation of chip-level spatial
power maps for commercial Google Coral M. 2 TPU chips based on a machine-learning …