Manufacturing-aware physical design
Ultra-deep submicron manufacturability impacts physical design (PD) through complex
layout rules and large guard-bands for process variability; this creates new requirements for …
layout rules and large guard-bands for process variability; this creates new requirements for …
Characterization and reduction of variation for integrated circuits
TH Smith, V Mehrotra, D White - US Patent 7,383,521, 2008 - Google Patents
US7383521B2 - Characterization and reduction of variation for integrated circuits - Google
Patents US7383521B2 - Characterization and reduction of variation for integrated circuits …
Patents US7383521B2 - Characterization and reduction of variation for integrated circuits …
Characterization and reduction of variation for integrated circuits
TH Smith, V Mehrotra, D White - US Patent 8,001,516, 2011 - Google Patents
US8001516B2 - Characterization and reduction of variation for integrated circuits - Google
Patents US8001516B2 - Characterization and reduction of variation for integrated circuits …
Patents US8001516B2 - Characterization and reduction of variation for integrated circuits …
[图书][B] Design for manufacturability and statistical design: a constructive approach
Design for Manufacturability and Statistical Design: A Constructive Approach provides a
thorough treatment of the causes of variability, methods for statistical data characterization …
thorough treatment of the causes of variability, methods for statistical data characterization …
Characterization and verification for integrated circuit designs
D White, TH Smith - US Patent 7,174,520, 2007 - Google Patents
(63) Continuation-in-part of application No. 10/200,660, i 1331112231331"? led on Jul. 22,
2002, and a continuation-in-part of 6,124,197 A 9/2000 Fulford application No. 10/165,214 …
2002, and a continuation-in-part of 6,124,197 A 9/2000 Fulford application No. 10/165,214 …
Adjustment of masks for integrated circuit fabrication
D White, TH Smith - US Patent 7,367,008, 2008 - Google Patents
Related US Application Data Continuation-in-part of application No. 10/165.214, filed on
Jun. 7, 2002, and a continuation-in-part of application No. 10/164,844, filed on Jun. 7, 2002 …
Jun. 7, 2002, and a continuation-in-part of application No. 10/164,844, filed on Jun. 7, 2002 …
Dummy fill for integrated circuits
TH Smith, V Mehrotra, D White - US Patent 7,152,215, 2006 - Google Patents
5,854,125 A 12/1998 Harvey variation as a result of the electrochemical deposition
5,861,342 A 1/1999 Gabriel et al.(ECD), also referred to as electrochemical plating (ECP) …
5,861,342 A 1/1999 Gabriel et al.(ECD), also referred to as electrochemical plating (ECP) …
Method for manufacturing high density non-volatile magnetic memory
RK Malmhall, K Satoh, J Zhang, P Keshtbod… - US Patent …, 2014 - Google Patents
Methods of fabricating MTJ arrays using two orthogonal line patterning steps are described.
Embodiments are described that use a self-aligned double patterning method for one or …
Embodiments are described that use a self-aligned double patterning method for one or …
Dummy fill for integrated circuits
TH Smith, V Mehrotra, D White - US Patent 7,124,386, 2006 - Google Patents
(57) ABSTRACT A method and system are described to reduce process variation as a result
of the electrochemical deposition (ECD), also referred to as electrochemical plating (ECP) …
of the electrochemical deposition (ECD), also referred to as electrochemical plating (ECP) …
[PDF][PDF] Models of process variations in device and interconnect
Variation is the deviation from intended or designed values for a structure or circuit
parameter of concern. The electrical performance of microprocessors or other integrated …
parameter of concern. The electrical performance of microprocessors or other integrated …