Low-temperature copper (Cu) sinter-joining technology has attracted increasing attention in
high-power electronic device packaging because of its low material cost, good electrical and …

Power modules applied in offshore applications are facing risks of corrosion failures on die-
attach materials due to high humidity and H 2 S exposure. To investigate such corrosion …

To address the drawbacks of conventional anisotropic conductive films in flexible
electronics, this study explored a novel flexible interconnection system comprising a flexible …

In the pursuit of advanced materials, researchers have turned to nanocomposites as a
means to enhance both electrical conductivity and mechanical properties. The integration of …

In this paper, a mixed sintering accelerator of colophony and cetyltrimethyl ammonium
bromide (CTAB) was developed to improve the sintering properties of Cu nanoparticles …

Pastes were prepared using dendritic Cu particles as fillers, and a compression die
attachment process was implemented to establish a pure Cu joint using low-cost materials …

In order to omit the step of removing organic items in Cu–Cu joint with Cu paste and improve
the interface of the Cu–Cu bonding, a novel method based on cold spray deposition and …

Recent years, the sintered silver paste was introduced and further developed for power
electronics packaging due to low processing temperature and high working temperature …

Copper sintering can form interconnection as reliable as silver ones if not better. Oxidation is
the source of the challenges in terms of sintering, but a combination of controlled …

A porous Cu layer was deposited on a dummy Cu die and a dummy substrate, respectively,
by electroplating to form a bondline that can endure high temperatures, such as 300℃. The …