Pushing the envelope for heterogeneity: Multilayer and 3-D heterogeneous integrations for next generation millimeter-and submillimeter-wave circuits and systems

KK Samanta - IEEE microwave magazine, 2017 - ieeexplore.ieee.org
Millimeter-wave (mmW) and submillimeter-wave (sub-mmW) or terahertz (THz;> 300 GHz)
frequencies are receiving increasing interest due to their distinct advantages, such as wider …

A 1× 2 taper slot antenna array with flip-chip interconnect via glass-IPD technology for 60 GHz radar sensors

H Xia, T Zhang, L Li, FC Zheng - IEEE Access, 2020 - ieeexplore.ieee.org
A low cost, broadband and compact antenna in package solution (AiP) is proposed for 60
GHz low-power radar sensor applications. Following a glass integrated passive device …

Ceramics for the future: Advanced millimeter-wave multilayer multichip module integration and packaging

KK Samanta - IEEE Microwave Magazine, 2017 - ieeexplore.ieee.org
The advantages of higher-frequency operation, such as wider bandwidth and finer spatial
and temporal resolution, have led to increased interest in the use of millimeter-waves …

Ultra-miniaturized and surface-mountable glass-based 3D IPAC packages for RF modules

Y Sato, S Sitaraman, V Sukumaran… - 2013 IEEE 63rd …, 2013 - ieeexplore.ieee.org
This paper demonstrates ultra-miniaturized RF passive components integrated on thin glass
substrate with small Through Package Vias (TPVs) to realize 3D Integrated Passive and …

MIMO antenna design in thin-film integrated passive device

TC Tang, KH Lin - IEEE Transactions on Components …, 2013 - ieeexplore.ieee.org
This paper presents a novel approach to construct a multiple-input multiple-output (MIMO)
antenna in a small package based on integrated passive device (IPD) manufacturing …

Miniaturized hybrid Antenna combining Si and IPD™ technologies for 60 GHz WLAN Applications

C Calvez, C Person, JP Coupez… - … on Antennas and …, 2011 - ieeexplore.ieee.org
This paper presents the design of a packaged antenna including glass substrate. A square
patch antenna is implemented on glass substrate exploiting IPD™ technology, and excited …

Design of antenna on glass integrated passive device for WLAN applications

TC Tang, KH Lin - IEEE Antennas and Wireless Propagation …, 2013 - ieeexplore.ieee.org
An antenna miniaturization technique that can substantially miniaturize an antenna to allow
its incorporation into a compact package for WLAN (2.4-2.484 GHz) applications is …

Packaged hybrid Si-IPD™ antenna for 60 GHz applications

C Calvez, C Person, JP Coupez… - The 40th European …, 2010 - ieeexplore.ieee.org
This paper presents the design of a packaged antenna including glass substrate. A
rectangular patch antenna is implemented on glass substrate exploiting IPD™ technology …

Millimeter-wave antenna designs for 60 GHz applications: SoC and SiP approaches

C Calvez, R Pilard, C Person, JP Coupez… - International Journal of …, 2011 - cambridge.org
Antenna on chip (AoC) and antenna in package (AiP) solutions for millimeter-wave
(mmWave) applications and their characterization are presented in this paper. Antenna …

Planar antennas on integrated passive device technology for biomedical applications

O Diop, F Ferrero, A Diallo… - 2012 IEEE …, 2012 - ieeexplore.ieee.org
In this paper, we present the design of electrically small antennas for biomedical application
at 2.4 GHz. Performance of two different antennas built using the Integrated Passive Devices …