Within-tier cooling and thermal isolation technologies for heterogeneous 3D ICs
Thermal management in 3D ICs not only requires cooling, but may also require thermal
isolation in scenarios in which high-power chips (eg logic chips) are stacked along with low …
isolation in scenarios in which high-power chips (eg logic chips) are stacked along with low …
High-frequency analysis of embedded microfluidic cooling within 3-D ICs using a TSV testbed
In this paper, the impact of microfluidic cooling on the electrical characteristics of through-
silicon vias (TSVs) is investigated for three-dimensional (3-D) integrated circuits (ICs). The …
silicon vias (TSVs) is investigated for three-dimensional (3-D) integrated circuits (ICs). The …
[PDF][PDF] Hybrid microfluidic cooling and thermal isolation technologies for 3D ICs
Y Zhang - 2015 - core.ac.uk
Transistor scaling along with continued material innovation in ICs has propelled the
semiconductor industry during the past 50 years in terms of improvements in IC …
semiconductor industry during the past 50 years in terms of improvements in IC …