Measurement and interrelation of length scale of dendritic microstructures, tensile properties, and machinability of Al-9 wt% Si-(1 wt% Bi) alloys

TA Costa, M Dias, C Silva, E Freitas, AP Silva… - … International Journal of …, 2019 - Springer
Al-Si alloys are increasingly being employed in the aerospace industry, satellite bearings,
and inertial navigation systems. Hypoeutectic compositions are more attractive because of …

Correlation between microstructure and corrosion behaviour of Bi-Zn solder alloys

RS Septimio, MA Arenas, A Conde… - Corrosion …, 2019 - journals.sagepub.com
Bi-Zn solder alloys with different Zn contents (1.5, 2.7 and 5wt-%) were prepared by casting
and the correlation between the microstructure and corrosion behaviour by mean of direct …

Microstructure growth morphologies, macrosegregation, and microhardness in Bi–Sb thermal interface alloys

T Soares, C Cruz, A Barros, A Garcia… - Advanced Engineering …, 2020 - Wiley Online Library
Due to the rising demand for thermal management technologies within the electronics
industry, there has been an increased emphasis on developing new thermal interface …

[HTML][HTML] Plate-like growth in a eutectic Bi–Ni alloy: effects of morphological microstructure evolution and Bi3Ni intermetallic phase on tensile properties

C Cruz, T Lima, R Kakitani, A Barros, A Garcia… - Journal of Materials …, 2020 - Elsevier
The development of efficient thermal interface materials (TIMs) has become an emerging
demand mainly driven by the continual rise in power dissipation of high-performance …

Effect of microstructure features on the corrosion behavior of the Sn-2.1 wt% Mg solder alloy

C Cruz, T Lima, M Soares, E Freitas, E Fujiwara… - Electronic Materials …, 2020 - Springer
Abstract The Sn–Mg eutectic alloy is a potential replacement for the traditional Sn-38.1 wt%
Pb solder alloy, since lead has been banned because of its risk to human health and the …

Interface evaluation of a Bi–Zn eutectic solder alloy: Effects of different substrate materials on thermal contact conductance

R Septimio, C Cruz, M Xavier, T Lima, A Garcia… - International Journal of …, 2021 - Elsevier
Industry is searching for ways of improving the process control required for the manufacture
of electronic circuitry. In this respect, a numerical mathematical model for thermal contact …

Structure tailoring and nucleation behavior of Bi droplets embedded in a Zn matrix

B Zhao, K Ding, M Wu, H Ma, G Wu, Q Zhai… - Journal of Alloys and …, 2019 - Elsevier
Well-characterized nucleants are important for heterogeneous nucleation because of their
catalyst effect. In this study, micro-and nano-sized Bi droplets embedded in the Zn matrix …

Effect of isothermal ageing process on microstructural changes in Bi-Ag lead-free solder alloys

AH Mohamed Ariff, N Ghamarian… - Advances in Materials …, 2022 - Taylor & Francis
Despite numerous studies on lead-free solder in recent years, only a limited number of
publication is available on high temperature lead-free alternative solders to replace high …

Sn-Mg lead-free solder alloy: Effect of solidification thermal parameters on microstructural features and microhardness

CB Da Cruz, TS Lima, TA Costa, C Brito… - Materials Research …, 2019 - iopscience.iop.org
In the last decade, several studies have been developed on lead-free alloys as potential
candidates to replace Sn–Pb alloys in soldering processes. Sn–Mg alloys arise as …

Galvanic corrosion analysis of a Bi–Zn solder alloy coupled to Ni and Cu substrates

RS Septimio, MA Arenas, A Conde… - Corrosion …, 2020 - journals.sagepub.com
Corrosion has become a frequent and significant issue in the electronics industry. For this
reason, galvanic corrosion of soldered joints, ie when solder alloys are in contact with a …