Atomic layer deposition of protective coatings for semiconductor process chamber components
D Fenwick, JY Sun - US Patent 11,326,253, 2022 - Google Patents
A multi-component coating composition for a surface of a semiconductor process chamber
component comprising at least one first film layer of a yttrium oxide or a yttrium fluoride …
component comprising at least one first film layer of a yttrium oxide or a yttrium fluoride …
Metal oxy-flouride films based on oxidation of metal flourides
US10563303B2 - Metal oxy-flouride films based on oxidation of metal flourides - Google
Patents US10563303B2 - Metal oxy-flouride films based on oxidation of metal flourides …
Patents US10563303B2 - Metal oxy-flouride films based on oxidation of metal flourides …
Plasma resistant coating of porous body by atomic layer deposition
V Firouzdor, S Banda, R Dhindsa, D Byun… - US Patent …, 2020 - Google Patents
Described herein are articles, systems and methods where a plasma resistant coating is
deposited onto a surface of a porous chamber component and onto pore walls within the …
deposited onto a surface of a porous chamber component and onto pore walls within the …
Multi-layer plasma resistant coating by atomic layer deposition
Described herein are articles, systems and methods where a plasma resistant coating is
deposited onto a surface of a chamber component using an atomic layer deposition (ALD) …
deposited onto a surface of a chamber component using an atomic layer deposition (ALD) …
Flourination process to create sacrificial oxy-flouride layer
An article comprises a body having a coating. The coating comprises a Y—O—F coating or
other yttrium-based oxy-fluoride coating generated either by performing a fluorination …
other yttrium-based oxy-fluoride coating generated either by performing a fluorination …
Plasma resistant coating of porous body by atomic layer deposition
V Firouzdor, S Banda, R Dhindsa, D Byun… - US Patent …, 2021 - Google Patents
Described herein are articles, systems and methods where a plasma resistant coating is
deposited onto a surface of a porous chamber component and onto pore walls within the …
deposited onto a surface of a porous chamber component and onto pore walls within the …
Method of forming dielectric films, new precursors and their use in semiconductor manufacturing
C Dussarrat, N Blasco, A Pinchart… - US Patent 8,668,957, 2014 - Google Patents
5,527,752 A 6/1996 Reichle et al. 5,846,895 A 12/1998 Gila et al. 5,861,352 A 1/1999 Gila et
al. 6,001,742 A 12/1999 Chang 6,197.683 B1 3/2001 Kang et al. 6,268.448 B1 7/2001 …
al. 6,001,742 A 12/1999 Chang 6,197.683 B1 3/2001 Kang et al. 6,268.448 B1 7/2001 …
Plasma-enhanced deposition process for forming a metal oxide thin film and related structures
P Raisanen, S Marcus - US Patent 8,383,525, 2013 - Google Patents
Methods of forming metal oxide thin films and related structures are provided. One
embodiment of the methods includes conducting a plurality of cycles of deposition on a …
embodiment of the methods includes conducting a plurality of cycles of deposition on a …
Apparatus and method for plasma assisted deposition
CA Chen, A Gelatos, MX Yang, M Xi… - US Patent …, 2006 - Google Patents
Embodiments of the present invention relate to an apparatus and method of plasma assisted
deposition by generation of a plasma adjacent a processing region. One embodiment of the …
deposition by generation of a plasma adjacent a processing region. One embodiment of the …
Method of film deposition using activated precursor gases
H Chung, L Chen, VW Ku - US Patent 6,838,125, 2005 - Google Patents
5,262,610 A 11/1993 Huang et al........... 219/121.43 cyclical deposition process, wherein the
activated precursor 5,306.666 A 4/1994 Izumi gas and a reducing gas are alternately …
activated precursor 5,306.666 A 4/1994 Izumi gas and a reducing gas are alternately …