Abstract Large Ag 3 Sn plates in solder joints can affect the reliability of electronics,
however, the factors affecting their nucleation and morphology are not well understood …

The liquid/solid (L/S) interface of dissimilar metals is critical to the microstructure,
mechanical strength, and structural integrity of interconnects in many important applications …

In this study, Ni foam, Cu coated Ni foam and Cu-Ni alloy foams were used as strengthening
phases for pure Sn solder. Cu-Cu joints were fabricated by soldering with these Sn-based …

High temperature solders have experienced a marked increase in demand due to the boom
of high power interconnects in electric vehicles and the miniaturisation of electronic devices …

Abstract The effects of 0.05 wt% Ni additions on In-35 wt% Sn (In–35Sn) alloy on the ex-situ
interfacial reactions, in-situ microstructures formation during solidification, and mechanical …

Multiple reflow processes are utilized in complex electronic devices with multi-layered PCBs,
stacked components, or 3D configurations to ensure reliable connections and minimize …

Solid liquid interdiffusion (SLID) bonding that can fabricate high-melting point full IMC joints
is playing an increasing key role in 3rd-generation semiconductor power electronic device …

This investigation aimed to examine the development mechanism of Cu–Ni–Sn compounds
and analyze the mechanical properties of mixed solder (MS) joints. Results show that an …

Cu 6 Sn 5 is the most prominent intermetallic developing eg in solder joints between a Cu-
based conductor material and a Sn-based solder. Mechanical reliability issues connected …

Sn based solders used in the electronic packaging industry exhibit unpredictable failures
due to their highly anisotropic properties, where thermal stresses, position within a package …